Steve, David, Earl, Werner, George, Brian (if you are watching), and any
TechNetter who can help,

I need to find out if there is a good way to dissipate a large amount of
heat from the top of a PCB (DS and MLB) to the bottom.
I would be interested in hearing pros and cons about filled and or plugged
vias.
Also any other more efficient fabrication methods.
Please feel free to contact me on-line, off-line, by phone or any way you
can.
I need to find a viable solution to the removal of a lot of heat.
I highly appreciate your help.
Thanks in Advance
FNK


Frank N Kimmey, C.I.D.+
Senior PCB Designer
Powerwave Technologies
PH. 916-941-3159
Fax 916-941-3195

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