Hi Steve,

It seems more likely that your assembler is making this request in order to
reduce shorting between adjacent chip components, not shorts between two
pads of a single component. When exposed to wave solder, adjacent chip
components can often short together if there is not enough spacing between
them. A minimum of .040" is usually optimal. Also depends on board
orientation relative to the wave.

I suppose a line of silkscreen between the chips may help also, but I've
never seen this.

Regards, Dave

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