All,

 I am looking for information pertaining to standard specifications (IPC or
such)regarding "peel strenght" of SMT solder joints. Specifically an SMT
header connector. We are trying to perform a "pull test" but I read in an
archived Technet message that suggested there was no such thing as a "pull
test", instead refering to this method as a peel strenght test. However, I
would like more information on this practice if anyone can assist.

thank you,

Steve Wormlight

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