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July 2002

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Subject:
From:
Ken Carlile <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 30 Jul 2002 10:07:57 -0400
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text/plain (86 lines)
Phil:

Thank you very much!  This was exactly what I was looking for!  I am sure
our very quality minded PCB fab house will not even question our RMA
request, however it is always nice to have something  supporting your
findings!

Ken

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of DUTTON Phil
Sent: Tuesday, July 30, 2002 1:50 AM
To: [log in to unmask]
Subject: Re: [TN] Silscreen on SMT pads


Hello Ken,

IPC-6012 states that, "marking shall not cover areas of lands that are
to be soldered."
The marking ink will interfere with the solder joint.

regards,

Phil Dutton C.I.D.

-----Original Message-----
From: Ken Carlile [mailto:[log in to unmask]]
Sent: Tuesday, 30 July 2002 05:05
To: [log in to unmask]
Subject: [TN] Silscreen on SMT pads


Can anyone kindly tell me if IPC has a guideline for silkscreen on SMT
pads?  Our master drawing notes
read: "As with solder mask, no marking ink shall encroach or be apparent
on solder termination pads or
areas".  Therefor we have internal reason to reject these, however I was
hoping there was an industry standard.

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