> The URL for this important lead free symposium is shown below.
> http://www.ipc.org/html/Lead-Free%20Nemi%20Symp%20Bro%20.pdf
> IPC-Association Connecting Electronics Industries® and the National Electronics Manufacturing Initiative (NEMI) are sponsoring a symposium on lead-free electronics September 18 and 19 in Montreal. IPC is offering half-day and full-day education courses on Wednesday the 18th; followed by a final report from the NEMI Lead-Free Assembly Project on the 19th. The NEMI session will also be web cast for anyone interested in attending but unable to participate onsite.
> The IPC education programs offer one full-day session on lead-free assembly and soldering, and three half-day sessions on: 1) lead-free solder joint reliability; 2) lead-free soldering, focusing on metallurgical fundamentals, reflow applications and challenges; and (3) final finishes, looking at HASL (hot air solder leveling) and its lead-free alternatives.
> The full-day seminar on Thursday will review the results from NEMI> '> s three-year Lead-Free Assembly Project, including a matrix of reliability tests. Sessions include discussion of selection criteria used to identify the NEMI-recommended Sn3.9Ag0.6Cu alloy, final results of reflow solder process development and reliability testing, analysis of component compatibility with lead-free soldering processes, and suggested use specifications for the NEMI-recommended SnAgCu alloy. In addition, the seminar will review results to date from NEMI> '> s investigation of tin whiskers, including discussion of efforts to devise accelerated tests for predicting tin whiskers and modeling efforts to understand why whiskers form and how to control them.
> 
> 
> David W. Bergman, CAE
> Vice President, Standards, Technology & International Relations
> IPC
> 2215 Sanders Road #250
> Northbrook, IL  60062-6135    USA
> Direct Phone 847-790-5340 
> IPC Main Phone 847-509-9700
> Direct Fax 847-504-2340
> Mobile 847-867-1388
> email  [log in to unmask]
> IPC website www.ipc.org
> 

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