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July 2002

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jul 2002 08:51:13 -0400
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Good Friday Morning,

Is there an existing standard or some published document (it needn't be an industry standard) that outlines heat sink assembly using thermal interface materials?  I'm trying to put together some assembly guidelines for my assemblers and my out source vendors so we all can have a reference or target for what is expected.

Thanks in advance,

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.

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