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July 2002

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Jul 2002 13:37:38 -0500
Content-Type:
text/plain
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text/plain (67 lines)
Earl,
You quoted several IPC documents that I was not award of. I am unable to
find them in the IPC library that I copied  in 01/21/02.   Is there some
information missing on the reference IPC-2315 and IPC-7095.   Can you
please HELP with a string on how I can purchase a hard copy from IPC.

victor,

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Tuesday, July 02, 2002 12:04 PM
To: [log in to unmask]
Subject: Re: [TN] Guidelines for tenting via's


I have more work to do on the check lists - maybe a lifetime's worth. The
following is my current concerning via tenting with references as indicated:

Blind vias (acceptable as mechanical or laser drilled holes with IPC-2315,
section 4 and supplier specified aspect ratios)

Buried vias ? same as above

Micro vias ? same as above

Vias in SMT pads (not acceptable under any condition except when filled and
plated over or when micro vias used per IPC-2315, section 7.3) per IPC-7095,
paragraph 6.3.1 and IPC-2315, section 7.3.2

Impact of wave soldering on top side BGA?s per IPC-7095, sections 6.4 and
6.5

Tented vias as above plus IPC-2221 and IPC-7095, paragraph 5.4.4, guidelines
and supplier recommendations concerning largest hole size that can be tented
without mask running down into holes. Consider hole plugging for large holes
so vias may be tented. Also see IPC-7095, section 5.4 for more solder mask
and tenting guidelines.

Earl

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