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July 2002

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Subject:
From:
Don Vischulis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Jul 2002 08:06:40 -0500
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Adam

Another concern is that the should be inverted half way through the etching
process. Otherwise the circuits will effectively move vertically upwards
because the lower edge undercuts significantly faster than the upper edge.

Don Vischulis

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Adam Seychell
Sent: Monday, July 22, 2002 9:49 PM
To: [log in to unmask]
Subject: [TN] immersion etching


Does anyone etch boards with a simple immersion dip in agitated solution
? I realize spray etching is the norm, but I was hoping to get some info
on immersion etching and avoid some of the problems of relatively
complex spray equipment. (since etching rate is not a prime concern for
us). After some experimentation I found agitation with large amounts of
fine bubbles works the best. About 80 L/min (3 cfm) of air evenly
distributed over a tank bottom area of 500x300mm (20"x12"). Porous
rubber hose seems to produce finer bubbles and better distribution than
a few holes drilled into a length of PVC piping. I'd be interested
learning more about what is out there in the world of etching.

regards,

Adam Seychell

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