Well thanks Rudy. So I take it that the major drawback of immersion etching
is not speed but the dreaded etch factor. Could explain why my first etching
system could make tin splinters from undercut of the tin plating resist.
I'll try and get a cross section view under a microscope and see it for my
own eyes.

On Mon, 22 Jul 2002 23:23:47 EDT, Rudy Sedlak <[log in to unmask]> wrote:

>Just realized, that your traces will probably wind up looking like the cross
>section of an aircraft carrier...all deck, and no width at the water level...
>
>Rudy Sedlak
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------