I thought we had this all settled and the cause was in excess of 9%
phosphorous in the plating solution. I'm a little behind it seems. Please
excuse and help.

I have at least 3 board shops proving to me on a regular basis they control
the black pad issue. None in over 3 years now and excellent solderability as
well.

I thought the BGA voiding issue was settled too. Wasn't is supposed to be in
the area of 20%?

Additionally, I need a test engineer of the R/F variety for a contract to do
what he/her does best. Looking at about 3 Ghz for transmit and receive and
must be capable of writing and implementing an adequate test plan for our
device/system.

MoonMan

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