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July 2002

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Subject:
From:
"Misner, Bruce" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Jul 2002 15:00:56 -0500
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text/plain (60 lines)
Ceramic substrates are typically not produced by a PCB fabrication house but
rather by a thick film house. For solder assembly the metallization is
usually PdAg and it is best soldered with Sn62 instead of Sn63.

Bruce Misner

> ----------
> From:         bonilla_d[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;bonilla_d
> Sent:         Monday, July 22, 2002 2:39 PM
> To:   [log in to unmask]
> Subject:      [TN] FW: PCB with Ceramic as substrate
>
> -----Original Message-----
> From: bonilla_d [mailto:[log in to unmask]]
> Sent: Monday, July 22, 2002 2:18 PM
> To: [log in to unmask]
> Subject: PCB with Ceramic as substrate
>
>
> Hi
>
> May somebody give me some a feedback from PCB fabrication house or Process
> Guidelines to deal with this kind of substrate?
>
> Regards
>
> David J Bonilla
> Manufacturing Technology Services
> Phone:787-746-1823 ext 241
> Fax:  787-746-3338
>
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