Steve,

As I mentioned, it was published in Feb this year.  It's a good paper, worth
reading.

Regards,
Bruce Misner

> ----------
> From:         Steve Gregory[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Monday, July 22, 2002 12:20 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Au-Ni coating
>
> I've never heard/read anything about uncured soldermask either. I've got a
> pretty good *.PDF file authored by Nicholas Biunno of Hadco, and presented
> at the '99 IPC Printed Circuits Expo that doesn't mention anything about
> soldermask...is this something new?
>
> -Steve Gregory-
>
>
>
>
>       Bruce:
>
>       My understanding of Black Pad was it is caused by too much
> phosphorus in the nickel (as I recall) plating bath.
>       Solder mask contamination is a new one for me.
>       With mask going on after the gold, how does it contaminate the
> nickel? Mask should not come in contact with the nickel at all in my
> experience
>
>       I am interested in learning all nuances of black pad causation.
>       Would appreciate your comments.
>
>       Charlie McMahon
>
>
>
>
>
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