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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 22 Jul 2002 11:16:52 -0500 |
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Sasportas,
Be very careful when using the " BLACK PAD " scenario. Audience can run
with this information
an make a mountain out of a mole hill. What is the suspected failing mode?
How was this identified
and/or confirm. If this is an ENIG process BGA, what reflow temp and how
many were subjected.
Reflow temps can lead to a thicker IMC region with nodules resulting in a
marginal BGA strength.
You will have to conduct BGA fault isolation and a series of analysis to pin
point the failing mechanism.
victor,
-----Original Message-----
From: Marki Sasportas [mailto:[log in to unmask]]
Sent: Monday, July 22, 2002 7:04 AM
To: [log in to unmask]
Subject: [TN] Au-Ni coating
Hello All,
I have problem in BGA rework, In some cases after, heating specific zone on
the board ( gold finish)
A near BGA joints are being defected. After taking off this BGA I noticed
that some of the pads are black,
What can cause the problem?
Thanks in advance,
Sasportas Marki,
CreoScitex Corporation Ltd.
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