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Subject:	Re: Au-Ni coating
From:	David Douthit <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 22 Jul 2002 09:21:28 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

Marki,

"Black Pad" failures are a well known problem.
Do a word search of the IPC files using the term "Black Pad".

The main issue is the nickel barrier layer under the gold finish.

David A. Douthit
Manager
LoCan LLC

Marki Sasportas wrote:

> Hello All,
>
> I have problem in BGA rework, In some cases after, heating specific zone on
> the board ( gold finish)
> A near BGA joints are being defected. After taking off this BGA I noticed
> that some of the pads are black,
> What can cause the problem?
>
> Thanks in advance,
> Sasportas Marki,
> CreoScitex Corporation Ltd.
>
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