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July 2002

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Subject:
From:
Roger Bilham <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 21 Jul 2002 12:09:41 +0100
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Hello Tehn,

Sb is now accepted as having no effect on formation of tin pest in
normal solder alloys and a modest amount, maybe up to 0.5%, will have
only marginal effect on solder wetting and joint brittleness. For more
info, I suggest you look at Soldering in Electronics by Klein-Wassink
(ISBN 0 901150 24 X) or the books by Howard Manko.

Regards,
Roger Bilham

In article <[log in to unmask]>,
Tehn Yit Chin <[log in to unmask]> writes
>Hi,
>
>I recently had our wave solder bath composition analysis and it came back
>with a value of <0.03% for antimony. Depending on who you talk to, it seems
>that the lack of antimony can generate tin pest under low temperature aging,
>and too much antimony causes brittle solder joints. Some says that antimony
>should be at 0.12%.
>
>I am not an industrial chemist, so I am rather confuse with this. Can anyone
>provide some insights or some documentations on what/why is the correct
>levels?
>
>thanks
>
>
>====================================================================
>Tehn Yit Chin                   mb: +61 418 139 181
>MILLISON TECHNOLOGY Pty. Ltd.   ph: +61 3 8793 9500
>Electronics Design Services     fx: +61 3 9798 7633
>http://www.millison.com.au      mailto:[log in to unmask]
>====================================================================
>
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--
Roger Bilham
Roger Bilham Consultancy
Tel: +44 (0)20 8467 8819
Fax: +44 (0)8700 548 613
Mobile +44 (0)7 941 122 446

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