Over the years, I have seen a lot of really messed-up solder joints,
especially on coated boards coming back for repair. If a test engineer
can't get his probes to make good contact, the tendency is to grind the
probe into the solder joint until he (or she) either does make contact or
gives up. By that time the solder joints are so mutilated by all the effort
that they have to be touched up with a soldering iron - an unnecessary
thermal excursion that does as much or more harm than good.

Actual recorded data, I don't have - only have this anecdotal stuff and
conclusions about theoretical reliability drawn therefrom.

Peter



Timothy Ground <[log in to unmask]>      17/07/2002 08:20 PM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Timothy Ground

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: [TN] ICT points








I have a question about In-Circuit Test for the group....


We have a new customer that has not given us test points in their PWB
design, leaving us few options but to probe components directly or not at
all.  Of course, we don't find this acceptable, and want to push back on
the customer.  Is anyone aware of any actual data regarding compromised
reliability or other problems that would come from probing parts?  Thanks.


Tim


Tim Ground
Quality Engineer
Kimball Electronics Group
ph:  812.634.4552
fax:  812.634.4112
[log in to unmask]


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