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| Reply To: | TechNet E-Mail Forum. |
| Date: | Tue, 16 Jul 2002 15:47:15 -0700 |
| Content-Type: | text/plain |
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Paul,
The following is the DoDs position on 217F:
I received this e-mail and I am glad to see that someone is working a
replacement for Mil Hdbk 217. As you may know, the DSIC made a decision
several years ago to let Mil Hdbk 217 "die a natural death". This is still
the current OSD position i.e. we will not support any updates/revisions to
Mil Hdbk 217.
George Desiderio, Deputy Director
Systems Engineering
OUSD(AT&L)/Interoperability
Tel: 703/695-2300
Fax: 703/614-9884
Cell: 703/582-7644
eMail: [log in to unmask]
David A. Douthit
Manager
LoCan LLC
Paul Signorelli wrote:
> i have a question about the new families of MSD components we have recently been seeing.
> There is now a new group of components being rated as Moisture Sensitive Devices, that are not IC's. e.g.: LED's, Capacitors, etc....
>
> Is the MSD level now becoming a Quality Level indicating the Quality or Reliability of the part instead of the vapor transmissiblity of the package to prevent the 'Popcorning' problem ?
> Should i purchase a level 2 (non-IC) part from one mfgr, rather than a level 3 (non-IC) part from another because it has successfully passed the Level 2 MSD qualification tests ?
> Are some (non-IC) manufacturers using the MSD Rating system to hide quality defects or inadequate high temperature construction materials ?
> i would suggest that anyone having component failures of these new MS devices
> perform detailed component failure analysis to see if there is a MS vapor transmission (popcorn) failure or some other high temperature failure mechanism (like reversion, epoxy degradation, or CTE problems).
>
> This all could result in a new revision of MIL-HDBK-217 to add 'Pi sub MSD' factors.
>
> Paul Signorelli
> Sanmina-SCI
>
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