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July 2002

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Subject:
Re: Moisture Sensitive Device Levels - A Reliability Indicator ?
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Jul 2002 14:28:38 -0700
Content-Type:
text/plain
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text/plain (53 lines) 
Paul,

Good idea!

Who pays for this?

Where would the analysis results be sent (Who is the custodian of 217F)?.

The DoD no longer "supports"  217F!

David A. Douthit
Manager
LoCan LLC


Paul Signorelli wrote:

> i have a question about  the new families of MSD components we have recently been seeing.
> There is now a new group of components being rated as Moisture Sensitive Devices, that are not IC's.  e.g.: LED's, Capacitors, etc....
>
> Is the MSD level now becoming a Quality Level indicating the Quality or Reliability of the part instead of the vapor transmissiblity of the package to prevent the 'Popcorning' problem ?
> Should i purchase a level 2 (non-IC) part from one mfgr, rather than a level 3 (non-IC) part from another because it has successfully passed the Level 2 MSD qualification tests ?
> Are some (non-IC) manufacturers using the MSD Rating system to hide quality defects or inadequate high temperature construction materials ?
> i would suggest that anyone having component failures of these new MS devices
> perform detailed component failure analysis to see if there is a MS vapor transmission (popcorn) failure or some other high temperature failure mechanism (like reversion, epoxy degradation, or CTE problems).
>
> This all could result in a new revision of MIL-HDBK-217 to add  'Pi sub MSD' factors.
>
> Paul Signorelli
> Sanmina-SCI
>
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