TECHNET Archives

July 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Linda Langley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 Jul 2002 08:41:38 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Anyone out there know where I can get some information about Ball Solder
Techniques?   IPC-610 gives some inspection standards but I would like to
have some type of procedure for making that type of solder joint. Or, point
me in the right direction for finding information.


Thanks
Linda

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2