Yeah, I hear ya'...but just to keep things bouncing around, using a additive
services solution for the pads, and then as Daan suggested, at least corner
bonding the device with a strong epoxy to the PCB after soldering, I think
would give the assembly the robustness needed to survive some pretty severe
four-wheeling (I know what you're talking about, we do stuff for UD).

Dead-bugging things will keep it all on the board, but you surely will lose
any sort of cooling that will be realized when having the part standing up on
it's leads as normal...will that be a problem?

This is a difficult situation, and I really appreciate it...believe it or
not, we've done work for your company, not your division...rolling meadows,
baltimore, DIRCM...

-Steve Gregory-

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------