Greetings, and happy Friday...

Can anyone comment on these for manual post-reflow inspection?  Do they net you an increase in defects found at that inspection point and a corresponding increase in FPY?  

We're looking for methods to reduce the number of random defects that get picked up at pcb test on some large (17" x 20") panels that are a real challenge for inspectors, and AOI is out of the question.   Thanks a bunch.


Steve Thomas
Automation Process Engineer
Mackie Designs, Inc.
Ph# (425)806-6365
email: [log in to unmask]

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