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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 15 Jul 2002 10:43:30 -0600 |
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IPC-7095 addresses this issue. Vias in pads will leave a void there but does not affect reliability as long as the pad is soldered to.
Rick
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Monday, July 15, 2002 6:54 AM
To: [log in to unmask]
Subject: [TN] Microvia/Buried via
Folks,
I am requesting assistance in locating reference material on
microvias/buried vias on component pads.
During a cross section of a BGA I am seeing a large solder void above a via.
Is this an acceptable process.
Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc: 512-725-3471
Pgr: 512-907-0005
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