A thank-you to Kathy and the other Technet folks who replied!

To clarify the issue:
gull wing lead, the foot is about .1" long and the heel overhangs the pad by .015 or so.  Thus absolutely no heel fillet.  Lots of side fillet, but as has been mentioned there isn't much strength there.  

Bonding the part would help with vibration, but I would still be worried about thermal expansion - this board will be seeing some temperature extremes.  I wouldn't buy off a waiver for something like that, so I'm doubting the customer would either.  On the other hand, it's their design and their schedule, so...  

Seriously though, a couple of adapter vendors have contacted me off line, we shall see if something can be agreed to by all involved.   At this point the 'ol dead bug option looks best to me but we shall see...

Thanks again all!

regards

Graham Collins
Process Engineer, 
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215

>>> [log in to unmask] 07/12/02 05:58PM >>>
you might be able to find an after market adapter.  I forwarded your original post to a company qfp-adapter.com and asked them to help out.  

When you mentioned the heel hangs off of the end of the pad, did you mean that the heel overhangs the front or back of the pad?  If the pad overhangs the front, well, you are in a pickle.  But if the heel is the only part of the solder joint that can not be achieved then why not determine the amount of joint that could be maintained to section 12 and then go for a deviation from any heel joint requirements due to an incorrect pad layout.    

Kathy 

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