I am going to assume that since your address has failure analysis you want an
etchant for microsection type evaluation and not to image circuitry from
copper clad laminate.  If this is true the one recommended by Buehler, Leco,
Struers and IPC test methods is

50% reageant grade Ammonium Hydroxide and 50% 3% Hydrogen Peroxide

You can mix your own 3% Peroxide if you have the 30%, however most use
the 3% available from drug stores.  This has stabalizers in it that seems to
work more consistantly.

Mix and allow to set for around 10 - 15 min then swab over area to be etched.


Susan Mansilla
Robisan Lab

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