Greetings...
Our overseas assembler wants us to add a line of silkscreen between pads on bottom-side 0603 R's and C's,
apparently as a solder dam to reduce bridging in wave solder. There already is mask between pads, so this seems
a bit out of the ordinary (we do very little two-sided assembly here but I have never seen bridging on chips).
Has anyone ever seen this done? Does this sound like a design band-aid to fix a process problem (talk about the flip side of
a coin!)? How do you attribute a bridge underneath a glued-on part to wave solder? I don't have the benefit of a thorough
knowledge of their process, but I'm speculating they may be printing their glue with a squeegee contaminated with solder paste.
Your thoughts?
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