Wendy - the IPC 4552 committee is currently working on a specification for
Immersion Tin and as such has a good representation of suppliers users and
fab members. You are more than welcome to join us in helping to write the
specification as well as gaining much insight from the members and users of
Tin.
regards

Gerard O'Brien
C0-chairman 4552
Photocircuits Corporation

-----Original Message-----
From: Worth, Wendy [mailto:[log in to unmask]]
Sent: Tuesday, July 16, 2002 8:03 AM
To: [log in to unmask]
Subject: [TN] Immersion Tin Plating


I am looking for some information on Immersion Tin plating. We have been
using
this finish at our facility for approximately 2 years and have encountered
many
issues with the cleanliness of the boards after the plating process, as well
as
solderability issues. Most instances of cleanliness issues have been in
regards
to what appears to be plating solution not being properly rinsed and dried
from
the board. I'm looking for feedback from other Immersion Tin users on what
sort
of issues they have encountered in using this finish (if any) as well as any
input on long term reliability issues ( intermetalic growth, tin migration,
etc). Thanks in advance for your help.

Wendy Worth
Material Quality Control
Harris Corporation

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