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July 2002

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From:
Steve Gregory <[log in to unmask]>
Date:
Fri, 12 Jul 2002 23:13:18 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Yeah, I hear ya'...but just to keep things bouncing around, using a additive
services solution for the pads, and then as Daan suggested, at least corner
bonding the device with a strong epoxy to the PCB after soldering, I think
would give the assembly the robustness needed to survive some pretty severe
four-wheeling (I know what you're talking about, we do stuff for UD).

Dead-bugging things will keep it all on the board, but you surely will lose
any sort of cooling that will be realized when having the part standing up on
it's leads as normal...will that be a problem?

This is a difficult situation, and I really appreciate it...believe it or
not, we've done work for your company, not your division...rolling meadows,
baltimore, DIRCM...

-Steve Gregory-

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