I am looking for some way to place 12 mil solder balls on 50 mil pitch.
Approximately 2500 balls on a substrate.  I have some method to do so that
is flux free, but the heat required is too great for my insulation
material.  Even a tool to place solder balls without use of flux or paste
would help.  I feel I could overcome the other obstacles.    Either that,
or I need an insulation/passivation material that is photoimagable and can
withstand 500°C.

Can anyone help??


Thank You,

Dennis Fall
Process Engineering Supervisor
Thin Film Technology Corporation
North Mankato, MN 56003-1702
Email: [log in to unmask]
Phone: 507-625-8445
Fax: 507-386-9269
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