When running SMT boards thru an IR reflow oven are there any guidelines, IPC
documents, gut feelings that tell whether gluing is necessary for parts that
would be on the bottom side during the top side reflow? I have at least one
160 pin TQFP that would be on the bottom. Is there a formula like mass
versus total pin area?

Thanks in advance for the advice.

Dave Snyder
HM Electronics, Inc.

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