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June 2002

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Fri, 7 Jun 2002 10:17:05 +0100
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This is done by utilising the fact that copper oxide has a slightly lower
melting point than pure copper, so oxidised copper parts are run through a
furnace at just over the oxide melting point and below the metal melting to
"solder" the liquid copper oxide into the ceramic (usually aluminium oxide /
alumina). The process was originally developed by GE so you could try there,
or current suppliers like Kuramik in Germany, Toshiba and so on might be
able to help you.

Kind Regards

Mike Fenner

Applications Engineer, European Operations
Indium Corporation
 T: + 44 1908 580 400
M: + 44 7810 526 317
 F: + 44 1908 580 411
 E: [log in to unmask]
W: www.indium.com
Leadfree: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dennis J. Fall
Sent: Thursday, June 06, 2002 7:54 PM
To: [log in to unmask]
Subject: [TN] Direct copper bonding


Where can I get more information on how to perform direct copper bonding to
alumina?

Thank You,

Dennis Fall
Process Engineering Supervisor
Thin Film Technology Corporation
North Mankato, MN 56003-1702
Email: [log in to unmask]
Phone: 507-625-8445
Fax: 507-386-9269

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