Yes...John,
 We are using it in one of our prototypes.... Seen some failures in
rework... the part doesn't seem to like the heat required to remove BGA's
that are near to it... Recommend spacing it away from other BGA's that might
affect it in re-work.  The failed solder bonds inside the part melted
allowing opens, looks like its a hybrid of some sort, or lumped elements
inside after looking at the x-rays...
We approximated the land pattern as closely as we could to their recommended
pattern... seems to solder fine... good luck.
- Bill Brooks


-----Original Message-----
From: Thorup, John [mailto:[log in to unmask]]
Sent: Thursday, June 06, 2002 9:16 AM
To: [log in to unmask]
Subject: [TN] recommended land pattern


I'm looking at this recommended pattern for a Dallas/Maxim BGA that's quite
unlike anything I have seen before.
http://pdfserv.maxim-ic.com/arpdf/DS32kHz.pdf   This BGA has two columns of
nine 25 mil eutectic balls at 50 mil pitch on either side of the package.
The recommended pattern consists of 28 mil diamond shapes.  Has anyone used
this pattern? Comments?
Thanks  - John Thorup

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