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June 2002

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Subject:
From:
"Dennis J. Fall" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Jun 2002 13:54:27 -0500
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Where can I get more information on how to perform direct copper bonding to
alumina?

Thank You,

Dennis Fall
Process Engineering Supervisor
Thin Film Technology Corporation
North Mankato, MN 56003-1702
Email: [log in to unmask]
Phone: 507-625-8445
Fax: 507-386-9269

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