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June 2002

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Wed, 5 Jun 2002 09:41:19 +0100
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This is the soldering variant of the old "If I was going there, I wouldn't
start from here" situation....

Nickel is difficult to solder because it rapidly forms a thin hard to remove
oxide layer. So the best thing to do is not try to solder nickel as removal
of the oxide layer is what you have to do of course to make solder joints.

The next best thing to do is to prevent this from happening by coating the
nickel as soon after it is plated as possible. A thin layer of gold is
commonly used on PCB's to make the familiar ENIG finish.

IF you rally do have to solder plain uncoated nickel, you could remove the
oxide layer before hand with a dilute HCl rinse and wash, or use a
proprietary solution for this. Then either solder immediately or coat with
some type of protective layer. Depending on your coating technology/method
you could increase the time window for a no clean type flux to a few weeks
or even months. (as ENIG)

If you don't want to go down this road you will need to use an active flux
and clean. Active most likely means a water soluble type. Some high halide
activated rosin fluxes might be suitable, but will also still need to be
cleaned for any electronic application.



Kind Regards

Mike Fenner

Applications Engineer, European Operations
Indium Corporation
 T: + 44 1908 580 400
M: + 44 7810 526 317
 F: + 44 1908 580 411
 E: [log in to unmask]
W: www.indium.com
Leadfree: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy Bergman
Sent: Tuesday, June 04, 2002 9:31 PM
To: [log in to unmask]
Subject: [TN] Soldering Nickel


Hello Tech Netters,

I am looking for some information about nickel finish boards. Is there
anything that has to be done to the nickel before soldering? Activation?

Thanks
K Bergman

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