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June 2002

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Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Jun 2002 10:20:15 -0400
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Jean-Francois,

I think one possibility is that flux residue may have built up in the
cooling section of your reflow oven and has then dripped down onto your
board.

Thanks,
Robert Furrow
Printed Wiring Board Engineer
Supply Chain Networks
Lucent Technologies
978-960-3224    [log in to unmask]


-----Original Message-----
From: Bissonnette, Jean-Francois [mailto:[log in to unmask]]
Sent: Wednesday, June 26, 2002 9:41 AM
To: [log in to unmask]
Subject: [TN] liquid residue between lands


Hi all,

We recently had a problem on a assembled part that had some kind of liquid
residues between lands
on the pcb.  It is conductive and would not evaporate even if heated up with
a heat gun.  In some
other areas the residues (don't know if they are of the same origin) had
more the apprearance of syrup.

Anyone can tell me what this is?

Thanks in advance!

Jean-François Bissonnette
Vérificateur, Contrôle de la Qualité
Électronique
Produits et Procédés
Vapor Rail Inc.
10655 Henri-Bourassa O.
St-Laurent, Qc
H4S 1A1

(514) 335-4200 x2021
(514) 335-4231 fax




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