TECHNET Archives

June 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Jun 2002 07:36:56 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
Hi Peter,
I have heard about "Fatigue Resistant Solders" but I have never seen any
evidence that those in fact are fatigue resistant in actual use environment.
Inaccelerated testing fine-grained solder last about double the fatigue
cycles than coarse grained solder, but that does not translate to a real
reliability increase in non-accelerated environments. Have you seen any real
evisence?

Werner Engelmaier

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2