Does this standard address the baking of flexible printed circuits prior to
assembly?

I am interested in any information available on this subject.

Thanks

Debbie Kenney
Engineer
M-Flex / AMT
Direct  (714) 688-5242
Fax     (714) 996-3834
[log in to unmask]

> -----Original Message-----
> From: Francois Monette [SMTP:[log in to unmask]]
> Sent: Friday, June 21, 2002 6:50 AM
> To:   [log in to unmask]
> Subject:      [TN] Moisture sensitive device
>
> Hi Marki,
>
> I don't think that anyone has answered your question yet, so here it is :
>
> The proper bake conditions, along with other handling guidelines for
> moisture-sensitive devices are all documented in J-STD-033, a joint
> IPC/JEDEC standard. The standard does not address vaccum bake but it
> includes a table for simple temprature bake cycles at 40C for components
> in
> reels and 125C for components in trays. The actual duration varies based
> on
> the MS level of the component and its body thickness.
>
> The default bake cycle for components in reels is 68 days at 40C. (yes 68
> days as in two months). Most assemblers cannot live with this kind of
> cycle
> time so the solution is to remove all components from the reel, bake them
> at
> 125C and then re-tape them or use them in JEDEC trays. The default cycle
> time at 125C is 48 hours. I am aware that some people use a combination of
> vaccum and temperature to reduce the bake duration and I can provide you
> with some technical articles and oven suppliers if you are interested.
>
> Regards,
>
> Francois Monette
> Cogiscan Inc.
> Tel : 450-534-2644
> Fax : 450-534-0092
> [log in to unmask]
> www.cogiscan.com
>
>
> Date:    Tue, 18 Jun 2002 09:37:43 +0200
> From:    Marki Sasportas <[log in to unmask]>
> Subject: Moisture sensitive device
>
>  Hi Technos,
>
> Can someone tell me at what conditions  (Vacuum&Temperture) should I dry
> those components which are
> packed in reel.
>
>  Thanks in advance,
> Marki Sasportas.
>
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