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June 2002

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Mon, 24 Jun 2002 13:00:27 -0400
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Hi, Inge, could you let me know if you bonded on Ni-P or Ni (electrolytic?).
thanks...jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord
>(EMW)
>Sent: Monday, June 24, 2002 8:51 AM
>To: [log in to unmask]
>Subject: Re: [TN] Wire bondable gold
>
>
>Steve & Steve,
>we have been wedgebonding directly on  heavy nickelplated
>aluminium plates without problem, large mass use to couple
>mechanical waves better than weak materials that swing by. So, I
>think too that it has to do with the gold structure, hardness or
>temperature . First thing we use to do is using hard rubber or
>scalpel blade, just to make sure we don't have some surface
>contamination. Next, check workholder, both for temperature and
>mechanical support. If there is a space between the object and the
>workholder, ultrasonic mismatch can make bonding impossible.
>Another annoying matter is sometimes that the insulator becomes to
>soft, as Steve says, then you may have to try without preheat. I
>assume you have the correct capillary and wire hardness for the job.
>
>Ingemar Hernefjord
>Ericsson Microwave Systems
>
>
>
>-----Original Message-----
>From: Creswick, Steven [mailto:[log in to unmask]]
>Sent: den 24 juni 2002 12:05
>To: [log in to unmask]
>Subject: Re: [TN] Wire bondable gold
>
>
>Steve,
>
>I echo what Joe has already said.  This amount of gold should not be a
>problem for gold wire bonding unless the components have not attained
>bonding temperature (on the order of 150C), or something is
>moving/softening
>during bonding.
>
>Even aluminum wire should bond well to this amount of gold - but
>also as Joe
>indicated, the long term reliability may be of some question.
>
>See if the Customer can share a bit more info with you as to the type of
>bonding performed, temperatures, and the type of problems experienced.
>
>Steve Creswick - Gentex
>
>-----Original Message-----
>From: Steve Kelly [mailto:[log in to unmask]]
>Sent: Saturday, June 22, 2002 11:22 AM
>To: [log in to unmask]
>Subject: [TN] Wire bondable gold
>
>
>We made some flex circuits for a customer and wound up putting too
>much gold
>on - approx. 75 microinches. The nickel is averaging 153. The gold
>meets all
>the purity specs. Under the wire bond area is a large heat sink.
>My customer
>is having difficulties wire bonding. Is too much gold a problem or can the
>heat sink cause issues. Regards Steve Kelly
>--------------------------
>Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net)
>
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