Guy,
The QC-100 from ECI can detect thicknes of the tin deposit. It actually can
break it down in three phases,
E-phase, N-phase, and pure tin and has the capability
of giving you the thickness of each, and the amount of copper migration. My
many months of testing(which included several suppliers of Imsn) and using
it with multiple pass wave cannot be accomplished with acceptable
solderability on the second pass, that is why I
stand by that IMsn is great for one pass only, but if you
have double sided surface mount you will have problems.
Ioan, the gentlemens name of contact at ECI is Mike Schneider(fine
Australian man). I am sure he can help
you with any further questions.
Tony Steinke
AIT-Atlanta
----- Original Message -----
From: "Guy Ramsey" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 21, 2002 4:25 AM
Subject: Re: [TN] Immersion Tin
> I think you're correct; Steve was thinking of a different tool.
>
> Two reflows then wave . . . HUMMM
> I can see two reflows then selective . . . AHHH
>
> But Dave, Ioan seemed to be having trouble after reflow. If the problem is
> formation of unprotected IM, would in-coming SERA predict the process
> problem?
> SERA attempts to measure oxide species and thickness not the actual tin
> thickness.
>
> More importantly, and based on your experience, would you expect IT to
> perform well in a multiple reflow process sequence?
> Wasn't this one of the big complaints about OSP?
>
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of Dave Hillman
> > Sent: Thursday, June 20, 2002 5:03 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Immersion Tin
> >
> >
> > Hi Steve! Sorry but I have to disagree with you. SERA is a tool which
can
> > be used to extensively characterize a variety of surface finishes on
> > printed wiring boards and any other surface that can be tested within
the
> > SERA equipment configuration limitations. I believe you may be confusing
> > SERA with ECI's CVS instrumentation. The CVS equipment measures certain
> > plating bath chemistry parameters. The SERA equipment is similar to
Auger
> > spectroscopy in analyzing surface finishes. Rockwell Collins has been
> > successfully using SERA since 1991 in a wide variety of applications
(keep
> > in mind I'm a bit biased on this subject - Rockwell Collins was heavily
> > involved in the development of the SERA equipment).
> >
> > Dave Hillman
> > Rockwell Collins
> > [log in to unmask]
> >
> >
> >
> >
> > Steve Kelly <[log in to unmask]>@ipc.org> on 06/19/2002 01:13:02 PM
> >
> > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>;
> > Please respond
> > to Steve Kelly <[log in to unmask]>
> >
> > Sent by: TechNet <[log in to unmask]>
> >
> >
> > To: [log in to unmask]
> > cc:
> >
> > Subject: Re: [TN] Immersion Tin
> >
> >
> > SERA will not help you - it is only a tool to measure tin /copper
> > concentrations . We have been running immersion tin for 5 years with no
> > issues but only one thermal excursion is allowed. The tin forms a
> > copper/tin intermetallic after thermal. We even silkscreen before tin to
> > eliminate this bake cycle. Regards Steve
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
> > Sent: Wednesday, June 19, 2002 12:07 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Immersion Tin
> >
> > Hi Tony,
> >
> > we experienced poor wave soldering after 2 reflows with immersion tin.
> > So,
> > please give me a few hints on SERA. Is it a test that the board house
> > will
> > do, or it has to be at our incoming? Does it imply additional charges?
> > Where
> > can I read more?
> >
> > Thanks,
> > Ioan
> >
>
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