TECHNET Archives

June 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Greg Jones <[log in to unmask]>
Reply To:
Greg Jones <[log in to unmask]>
Date:
Thu, 20 Jun 2002 13:10:16 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
I am working on an article/editorial for the Sept issue of an electronics
assembly publication.  The topic is the need to improve domestic (North
American) process efficiency and quality to retain a viable domestic
electronics assembly industry.
I would appreciate any comments, offline, on or off the record, on the issue
in general and specifically on what needs to be done to achieve this.
Thanks,

Greg Jones Ph.D.
Special Projects Manager
775.322.0158
KIC--Innovation That Works
www.kicthermal.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2