Ioan,
There's an interesting article at www.pfonline.com on practical
considerations of 'Flat Solderable Tin Finishes'. It talks about the
process in general including some test methods including SERA.
Regards,
Rick Thompson
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Wednesday, June 19, 2002 9:07 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Tin
Hi Tony,
we experienced poor wave soldering after 2 reflows with immersion tin.
So, please give me a few hints on SERA. Is it a test that the board
house will do, or it has to be at our incoming? Does it imply additional
charges? Where can I read more?
Thanks,
Ioan
> -----Original Message-----
> From: tony steinke [SMTP:[log in to unmask]]
> Sent: Wednesday, June 19, 2002 11:19 AM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Tin
>
> Grant,
> Having installed the Cookson(Dexter) FST chemistry a couple of years
> ago at my previous employer, there are concerns that you should be
> aware of. The immersion tin
> process is a beautiful thing if applied and processed properly. Some
of
> the
> major
> issues that I experienced were:
> Solder mask adhesion(you should tape test any incoming product)
> Request that SERA(sequential electromigration reduction analysis) test
be
> performed.
> And the biggest problem was getting acceptable solderability on second
> pass
> wave solder
> or second pass solder paste. The copper migration greatly accelerates
> during
> any thermal
> excursion, but that is what the SERA testing will show you.
> Tony Steinke
> [log in to unmask]
>
> ----- Original Message -----
> From: "Grant Emandien" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, June 19, 2002 3:06 AM
> Subject: [TN] Immersion Tin
>
>
> > Members,
> >
> > A PCB supplier has requested us to evaluate immersion tin as a
> > finish. Immediate concerns raised were shelf life, solderability,
> > whiskers, etc. Researching the archives has noted similar as well as
> > opposing views and concerns. In addition to possible problems
> > arising from immersion tin finish, what PCB fabricator process
> > changes may contribute to possible reliability and solderability
> > concerns and how this impacts production processes such as reflow.
> > The proprietary chemistry used is MacStan HSR
> from
> > Macdermid.
> >
> > Anyone willing to share experiences and guide me towards making an
> informed
> > decision.
> >
> > TIA
> > Grant
> >
> >
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