Ioan,
The company whom makes this equipment is called ECI Technology, you can go
to their web site and get alot of information. The machine is called a
QC-100.Chances are your board supplier does not have one for they are quite
expensive, but I am sure ECI will work with you if you wanted to do some
testing on your incoming product or better yet have your tin surface
analyzed after first wave solder.
Tony Steinke
AIT-Atlanta Inc.
----- Original Message -----
From: "Tempea, Ioan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, June 19, 2002 9:06 AM
Subject: Re: [TN] Immersion Tin
> Hi Tony,
>
> we experienced poor wave soldering after 2 reflows with immersion tin. So,
> please give me a few hints on SERA. Is it a test that the board house will
> do, or it has to be at our incoming? Does it imply additional charges?
Where
> can I read more?
>
> Thanks,
> Ioan
>
> > -----Original Message-----
> > From: tony steinke [SMTP:[log in to unmask]]
> > Sent: Wednesday, June 19, 2002 11:19 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Immersion Tin
> >
> > Grant,
> > Having installed the Cookson(Dexter) FST chemistry a couple of years
> > ago at my previous employer, there are concerns that you should be aware
> > of.
> > The immersion tin
> > process is a beautiful thing if applied and processed properly. Some of
> > the
> > major
> > issues that I experienced were:
> > Solder mask adhesion(you should tape test any incoming product)
> > Request that SERA(sequential electromigration reduction analysis) test
be
> > performed.
> > And the biggest problem was getting acceptable solderability on second
> > pass
> > wave solder
> > or second pass solder paste. The copper migration greatly accelerates
> > during
> > any thermal
> > excursion, but that is what the SERA testing will show you.
> > Tony Steinke
> > [log in to unmask]
> >
> > ----- Original Message -----
> > From: "Grant Emandien" <[log in to unmask]>
> > To: <[log in to unmask]>
> > Sent: Wednesday, June 19, 2002 3:06 AM
> > Subject: [TN] Immersion Tin
> >
> >
> > > Members,
> > >
> > > A PCB supplier has requested us to evaluate immersion tin as a finish.
> > > Immediate concerns raised were shelf life, solderability, whiskers,
etc.
> > > Researching the archives has noted similar as well as opposing views
and
> > > concerns. In addition to possible problems arising from immersion tin
> > > finish, what PCB fabricator process changes may contribute to possible
> > > reliability and solderability concerns and how this impacts production
> > > processes such as reflow. The proprietary chemistry used is MacStan
HSR
> > from
> > > Macdermid.
> > >
> > > Anyone willing to share experiences and guide me towards making an
> > informed
> > > decision.
> > >
> > > TIA
> > > Grant
> > >
> > >
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