There was a thread on this subject a couple of weeks or a month ago. The
long and short of it is the lead finish is compatible but the solder joint
will not look as good. Your oven profile may need adjustment (hotter with a
quicker spike to reflow) and results vary by flux. Some people suggest using
2% silver to promote wetting. Check out the archive, the guys at  Rockwell
Collins had some good input.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Brad Mecham
> Sent: Wednesday, June 19, 2002 9:22 AM
> To: [log in to unmask]
> Subject: [TN] Nickel-Palladium lead finish
>
>
> Hi fellow Technetters
>
> Recently we have received a notice from Philips that they are changing its
> external lead finish from “hot solder dip” to “Nickel-Palladium.”  I am
> guessing that this is move to go lead free.  Does anyone have experience
> working with this type of finish?  Is it compatible with regular tin/lead
> solder?  Any help would be greatly appreciated.
>
> Thanks,
> Brad Mecham
> Manufacturing Engineer
> KWM Electronics Corp
>

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