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June 2002

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Subject:
From:
Henry Rekers <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Jun 2002 08:20:03 -0700
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I've been dealing with the same issue for a while now.  We use a no-clean
process so it is even more challenging.  The biggest barrier you will have
to overcome is the fact that the solder joints will look much different.
You may have to adjust you pass/fail criterea.  If you are using no-clean,
get the most active one you can find.  I can tell you which one we are using
off line if that helps.

Henry.

-----Original Message-----
From: Brad Mecham [mailto:[log in to unmask]]
Sent: Wednesday, June 19, 2002 6:22 AM
To: [log in to unmask]
Subject: [TN] Nickle-Palladium lead finish


Hi fellow Technetters

Recently we have received a notice from Philips that they are changing its
external lead finish from "hot solder dip" to "Nickel-Palladium."  I am
guessing that this is move to go lead free.  Does anyone have experience
working with this type of finish?  Is it compatible with regular tin/lead
solder?  Any help would be greatly appreciated.

Thanks,
Brad Mecham
Manufacturing Engineer
KWM Electronics Corp

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