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June 2002

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Jun 2002 14:04:23 +0200
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Grant,

contact Sandra Winkler at :

Sandra Winkler is senior analyst at Electronic Trend Publications, San Jose, CA, (408) 369-7000, e-mail: [log in to unmask] Bance Hom is well known in the industry as the leading authority on IC Plating and is with Consultech International Inc., e-mail: [log in to unmask]

She has written a very good article with lots of refs in HDIonline. Actually, she has fallen in love with matte tin...she will perhaps tell you directly.

Regards

Ingemar Hernefjord
Ericsson Microwave Systems


-----Original Message-----
From: Grant Emandien [mailto:[log in to unmask]]
Sent: den 19 juni 2002 12:07
To: [log in to unmask]
Subject: [TN] Immersion Tin


Members,

A PCB supplier has requested us to evaluate immersion tin as a finish.
Immediate concerns raised were shelf life, solderability, whiskers, etc.
Researching the archives has noted similar as well as opposing views and
concerns. In addition to possible problems arising from immersion tin
finish, what PCB fabricator process changes may contribute to possible
reliability and solderability concerns and how this impacts production
processes such as reflow. The proprietary chemistry used is MacStan HSR from
Macdermid.

Anyone willing to share experiences and guide me towards making an informed
decision.

TIA
Grant


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