I am forwarding this question from one of the design engineers at
work.  We advertise we build class 3 products, but with all of our
thick boards, we get open traces.  We just found out that our
board vendor has been removing al the unused pads on the inner
layers.

Does getting rid of unused pads on all inner layers have any
profound affect on the PHT barrel integrity especially with high
layer count / thick circuit boards?

Thanks,

Gary Bremer
Manufacturing Engineer

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