Mike

I agree with the fact that MSD is an issue, we have been put on the hot
seat because of it. It will only get more critical as packages get thinner
and thinner.  And look out when a Lead Free process is used.
Look at www.cogiscan.com they have some additional information that will
aid in following the J-STD-033.
Also to note when looking at MSD in the process is when double sided
reflows are used.. Is the time between 1st and 2nd pass reflow longer then
your highest level part on side 1????
For purchasing/receiving , do you send IC's out for programming?  How does
the programming house handle them??  Do they bake before resealing, if not
you will have to reset the moisure clock before the parts can even go to
the production floor ( drives production schedulers nuts).
If programmed in house,, how long are they out of the packaging (
production scheduler may not take into account possible rebake times).

Good luck
its not an easy task or a simple solution.

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------