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June 2002

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Subject:
Wire bondable gold
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 22 Jun 2002 11:22:29 -0400
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We made some flex circuits for a customer and wound up putting too much gold on - approx. 75 microinches. The nickel is averaging 153. The gold meets all the purity specs. Under the wire bond area is a large heat sink. My customer is having difficulties wire bonding. Is too much gold a problem or can the heat sink cause issues. Regards Steve Kelly
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