-----Original Message-----
From: bonilla_d [mailto:[log in to unmask]]
Sent: Tuesday, June 11, 2002 9:28 AM
To: TechNet E-Mail Forum.
Subject: Flip Chip and Tape automated bonding feasibility and
Implementation Program


Hi

May somebody help to find out  how to develop a  flip chip  and tape
automated bonding feasibility program. Any feedback will be appreciated.

David J Bonilla
Manufacturing Technology Services
[log in to unmask]
Phone:787-746-1823 ext 241
Fax:  787-746-3338

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