Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 26 Jun 2002 13:06:21 -0500 |
Content-Type: | text/plain |
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Or GSC 972-494-1911
Ask for Bill
----- Original Message -----
From: "Barry Gallegos" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, June 26, 2002 10:43 AM
Subject: Re: [TN] Reflow on Wave.
> Henry,
> Have you considered a selective wave solder pallet.
> SP PRECISION @ 1800-725-5388
>
>
> Barry.
>
> -----Original Message-----
> From: Henry Rekers [mailto:[log in to unmask]]
> Sent: Wednesday, June 26, 2002 8:08 AM
> To: [log in to unmask]
> Subject: [TN] Reflow on Wave.
>
>
> Does anybody have any suggestions on avoiding reflow of a 357 ball bga on
> the wave? I'm dealing with a 6 layer board and I've kept the preheat as
low
> as possible. Kapton tape doesn't seem to help. Has anybody tried any
> custom manufactured sheilding?
>
> Thanks.
>
> Henry J. Rekers
> Manufacturing Engineer.
>
> --------------------------------------------------------------------------
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ext.5315
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---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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