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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 24 Jun 2002 07:29:18 -0500 |
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Steve,
I also agree that the Au thickness is fine for Au wire but could be a
reliability problem for Al. I have found that cooler temps (125C, even as
low as 110C) for softer substrates (non-ceramic) usually perform more
consistently when Au ball bonding. With Flex, getting proper clamping is
very often an issue and I would certainly examine that possibility.
Good Luck,
Bruce Misner
> ----------
> From: Steve Kelly[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Steve Kelly
> Sent: Saturday, June 22, 2002 11:22 AM
> To: [log in to unmask]
> Subject: [TN] Wire bondable gold
>
> We made some flex circuits for a customer and wound up putting too much
> gold on - approx. 75 microinches. The nickel is averaging 153. The gold
> meets all the purity specs. Under the wire bond area is a large heat sink.
> My customer is having difficulties wire bonding. Is too much gold a
> problem or can the heat sink cause issues. Regards Steve Kelly
> --------------------------
> Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net)
>
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